Semiconductor IP Industry News
September, 2017

September 28, 2017 - TEWKSBURY, Mass. - Avery Design Systems Inc., a leader in verification IP, today announced its collaboration with INVECAS, Inc. to facilitate interoperability of DDR-Xactor VIP and perform extended compliance validation using Avery DFI-PHY compliance test-suite.

“We are pleased to collaborate with Avery Design VIP Partner to support ...

Kilopass OTP NVM IP Will Store Calibration Values, Security Algorithms Keys, and Specific Configuration Data for Nuvoton End Customers

San Jose, Calif., September 27, 2017 - Kilopass Technology Inc., the leading provider of semiconductor logic anti-fuse one-time programmable (OTP) non-volatile memory (NVM) intellectual property (IP), today announced that Nuvoton ...

SANTA CLARA, Calif., Sep. 26, 2017 - Achronix, developer of Speedster® FPGAs, Speedcore™ eFPGAs and design tools, today announced Kent Orthner, Achronix, will speak about “Reprogrammable Logic in a Processor-Based SoC” at the upcoming Linley Processor Conference taking place on October 4-5, 2017 in Santa Clara. Additionally during the two-day ...

Bournemouth, UK, 25th Sep 2017 - Communications Consultants Worldwide Ltd. (CCww), global innovator of 3GPP technologies has licensed its NB-IoT protocol-stack software to a leading Shanghai and Silicon Valley based developer of highly integrated and unique mixed-signal SoC solutions. This relationship, catalyzed by T2M, will enable the production of the ...

Samsung Foundry tapes out industry first eMRAM test chip based on 28nm FD-SOI process

September 24, 2017 - SEOUL, South Korea - Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology, today announced it has expanded its differentiated FD-SOI process technology leadership by offering derivatives that include RF and ...

Plymouth, UK, 22nd September 2017 - Moortec, specialists in embedded in-chip subsystem solutions, are continuing their expansion with a move to a new UK Headquarters.

The new state of the art facility is located in the Plymouth Science Park which is the largest Science & Technology centre in the South West. ...

LONDON, Sept. 21, 2017 - Imagination Technologies (LSE:IMG) announces a new generation of PowerVR GPUs that raises the bar on graphics and compute in cost-sensitive devices, letting SoC vendors achieve a significant boost in performance with no impact on silicon area versus previous generation GPUs.

With the new PowerVR Series9XE ...

September 20, 2017 - At the 2017 GLOBALFOUNDRIES Technical Conference, Rambus will be showcasing its high-performance memory and SerDes PHYs developed for GLOBALFOUNDRIES high-performance ASIC Platform.

Additional Details:

HBM2

Optimized for the low-latency and high-bandwidth memory applications, the Rambus High Bandwidth Memory (HBM) Gen2 PHY delivers maximum performance and flexibility in minimal form ...

CAMPBELL, Calif. - September 19, 2017 - ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced that NXP Semiconductors has licensed additional uses of Ncore Cache Coherent Interconnect IP and Ncore Resilience Packages.

"We had an excellent experience implementing ArterisIP’s Ncore Cache Coherent Interconnect IP in ...

Cadence recognized for joint development of 7nm FinFET Plus design infrastructure and 12FFC design infrastructure and the joint delivery of the automotive design enablement platform

SAN JOSE, Calif., September 18, 2017 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has received three TSMC Partner of the Year awards ...

The state of the art intoPIX ULL technology compresses Broadcasters Live Content with the lowest latency possible and an incredible quality enabling Sencore to deliver JPEG2000 products beyond the current VSF TR01 specifications.

September 14, 2017 - IBC 2017 - AMSTERDAM - intoPIX, a leading provider of innovative compression technology, today ...

September 13, 2017 - Rambus Inc.:

What:

IBC 2017

Who:

Rambus Inc. (Nasdaq: RMBS)

Where:

Booth 1.A40
Europaplein 2-22
1078 GZ Amsterdam, Netherlands

When: September 15-19, 2017

At IBC 2017, Rambus will be showcasing its DPA Countermeasure Solution suite and its CryptoMedia Content Protection Core.

Additional details

DPA Countermeasure Solutions

The Rambus DPA Countermeasure Solution suite, including our ...

September 12, 2017 - Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at TSMC Open Innovation Platform® (OIP) 2017 in Santa Clara. The company will demonstrate its Comprehensive High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+. Additionally, Open-Silicon will be presenting a technical ...

DesignWare Foundation and Interface IP on TSMC 7-nm Process Technology Enables Faster Time-to-Market for Mobile, Automotive and High-Performance Computing SoCs

MOUNTAIN VIEW, Calif., Sept. 11, 2017 -

Highlights:

• Synopsys' successful tape-outs of DesignWare Interface PHY IP for TSMC's 7-nm process include USB 3.1/2.0, DisplayPort 1.4, PCI Express 4.0/3.1, DDR4, MIPI D-PHY, Ethernet and ...

September 8, 2017 - OmniPHY Semiconductor, Inc. today announced it will be showcasing how it leverages TSMC manufacturing technology to create robust automotive semiconductor IP solutions at the TSMC 2017 Open Innovation Platform® Ecosystem Forum. The event is being held on September 13, 2017, at the Santa Clara Convention ...

Highlights:

• Collaboration with TSMC enables comprehensive automotive IP portfolio support for automotive design enablement platform
• Design IP portfolio and subsystems address the needs of in-vehicle infotainment and building blocks for ADAS SoCs
• Interface IP area- and power-optimized for AEC-Q100 Grade 2 temperature range
• All Cadence IP designed to be ASIL-B-ready and ASIL-C/D-capable

SAN JOSE, Calif., ...

September 6, 2017, San Jose, Calif. - eSilicon, an independent provider of FinFET-class ASIC design, custom IP and advanced 2.5D packaging solutions, will deliver several presentations in booth 807 at the 2017 TSMC OIP Ecosystem Forum in Santa Clara, California at the Santa Clara Convention Center on September 13, 2017.

High-Performance ...

September 5, 2017 - Ottawa, Canada and Santa Clara, Calif. - Sidense is exhibiting and presenting a paper at the TSMC OIP Ecosystem Forum.

Where
Santa Clara Convention Center
5001 Great America Pkwy
Santa Clara, CA 95054
Booth #604

When
Wednesday, September 13
8:00AM to 6:30PM

What
Sidense will be exhibiting and presenting a paper, "Robust NVM Solutions for TSMC ...