Arm Veteran to Enable Next-Generation High-Performance Processor Development
SAN MATEO, Calif., Nov. 26, 2019 - SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced that Ann Chin has joined the company as vice president and co-general manager of the SiFive IP business unit. Chin joins ...
MOUNTAIN VIEW, California, Nov. 25, 2019 -
Highlights:
Broad Portfolio of Reusable Plug and Play VIP Fills Verification Coverage Gaps, Supports Code Coverage, Functional Coverage
SAN JOSE, CALIF. - November 21, 2019 – SmartDV™ Technologies, the Proven and Trusted choice for Verification Intellectual Property (VIP), today announced its broad portfolio of portable, platform-independent VIP ensures a thorough and seamless ...
November 20, 2019 - Moortec the go-to leaders of in-chip technologies will be showcasing their PVT Monitoring Subsystem IP at this week's CSIA-ICCAD which is taking place at the Nanjing International Expo Convention Center.
The Conference will discuss the opportunities and challenges faced by the IC industry and enhance the ...
SEOUL, South Korea – November 19, 2019 – With Korea the world’s largest manufacturer of memory semiconductors and leading in 300mm fab construction in 2019, the region is paving the way to SEMICON Korea 2020 as more than 500 companies and 55,000 visitors are expected to gather February 5-7 ...
Arasan Chip Systems a leading provider of semiconductor IP for mobile and automobile SoCs today announced the immediate availability of its MIPI D-PHY IP supporting the D-PHY v2.1 specification for speeds upto 4500 Mbps for TSMC 28nm SoC designs
Nov 18th, 2019, San Jose, CA: Arasan today announced the immediate availability ...
Santa Clara Calif. and Hsinchu, Taiwan, Nov. 05, 2019 - GLOBALFOUNDRIES® (GF®) and SiFive, Inc. announced today at GLOBALFOUNDRIES Technology Conference (GTC) in Taiwan that they are working to extend high DRAM performance levels with High Bandwidth Memory (HBM2E) on GF’s recently announced 12LP+ FinFET solution, with 2.5D packaging design ...