Semiconductor IP Industry News
January, 2021

XpressLINK-SOC Simplifies Arm-based SoC Designs, Enables Efficient Support of CXL and CCIX.

SAN JOSE, Calif. - January 19, 2021 - PLDA, the industry leader in high-speed interconnect solutions, today announced that PLDA’s industry-leading XpressLINK-SOC™ CXL IP provides full support for the AMBA® CXS Issue B (CXS-B) interface protocol. This support enables ...

GAINESVILLE, Fla., Jan. 21, 2021 - The 2021 Design and Verification Conference and Exhibition ( DVCon) U.S. will be held on a virtual platform with a combination of recorded and live Q&A. The information-packed technical program runs four days and includes 42 papers, four tutorials, 14 posters, two panels, 18 ...

Magnet-Free Contact-less Sensor Delivers High Accuracy, Easy Customization, and Smaller Weight and Size with Total Stray Field Immunity for Automotive

TOKYO - January 28, 2021 - Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched its magnet-free IPS2550 inductive position sensor. Featuring improved performance and easy customization, ...

SAN JOSE, Calif. and GUANGZHOU, China, Jan. 27, 2021 - GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, is pleased to announce the release of its new Automotive Grade FPGAs, targeting applications for telematics, infotainment, and the powertrain.

AEC-Q100 has been in place for over 20 years defining the reliability ...

PENANG, Malaysia - January 26, 2021 - With the world continuing to combat COVID-19, SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced the postponement of SEMICON Southeast Asia (SEA) to 17-19 August 2021 to ensure the safety of exhibitors, partners and guests. The ...

SAN JOSE, Calif., Jan. 25, 2021 - Synaptics® Incorporated (Nasdaq: SYNA), today announced its VideoSmart™ VS680 solution has been chosen as the Best Embedded Processor in The Linley Group’s Analysts’ Choice Awards 2020. The VS680 is a high-performance, AI-enriched System on a Chip (SoC) that brings combined video, vision, voice ...

Siemens today announced that its industry-leading tools for the verification of analog/mixed-signal (AMS) circuits are now qualified for early design starts on Samsung Foundry’s new 3nm Gate All Around (GAA) process technology.

With this certification, customers can now verify their early-stage AMS designs using the Analog FastSPICE™ (AFS) platform on ...

HSINCHU, Taiwan - January 21, 2021 - Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today unveiled its complete imaging and display high-speed interface IP set on UMC’s 40LP and 28HPC/HPC+ process nodes, including MIPI D-PHY (TX/RX, controller), V-by-One HS (TX/RX, controller), and LVDS (TX/RX, ...

MediaTek also announces Dimensity 1100 5G chipset to give device makers even more design flexibility

HSINCHU, Jan. 20, 2021 - MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6nm ...

CES - 18th January 2021: T2MIP, the global independent semiconductor IP technology & SW provider, is pleased to announce the licensing of its’ partners Bluetooth Dual Mode v5.2 Software Link Layer, Protocol Stack software, Profiles and LC3 codec in combination with 22nm RF IP Core to a leading Hearables semiconductor ...

Reading, UK – 18 January 2021. Because Sondrel offers a full turnkey service of ASIC production from design through to shipping silicon, it knows what is happening with services at every stage of the manufacturing and test process. It says that it has noticed increased lead times for SOC package ...

Cesson-Sévigné and Valbonne (France), January 12th, 2021 – Since entering into a strategic partnership in February of 2020, Menta and Secure-IC today announce that they have successfully co-developed a flexible solution that will allow next-generation SoCs to follow market security requirements over time.

Security standards evolve over time due to new ...

Collaboration Builds on Successful Adoption of Broad DesignWare IP Portfolio in Socionext's High-Performance AI Engine and Accelerator Solution

MOUNTAIN VIEW, Calif. and YOKOHAMA, Japan, Jan. 12, 2021 - Synopsys, Inc. (Nasdaq: SNPS) and Socionext, Inc. today announced their collaboration to expand Socionext's use of Synopsys' broad DesignWare® IP to include Synopsys' ...

SHENZHEN, China & ROCHESTER, Mich. - January 13, 2021 - Seeed and BeagleBoard.org® have announced an official collaboration with the leading RISC-V solutions provider, StarFive, to create the latest member of the BeagleBoard.org® series, BeagleV™ (pronounced Beagle five.) BeagleV™ is the first affordable RISC-V board designed to run Linux. BeagleV™, ...

EMA is extending its focus on designer productivity to the IC world by partnering with SkillCAD to bring their LAS (layout automation suite) to the Cadence® Virtuoso® User Community.

ROCHESTER, N.Y., Jan. 12, 2021 - EMA Design Automation® ( http://www.ema-eda.com), a full-service provider and innovator of Electronic Design Automation (EDA) systems ...

January 11, 2021 -

• Embedded NXP Layerscape processor delivers 2x increase in processing performance over previous platform to meet new vehicle architecture demands
• S32G processors support ASIL D level functional safety to enable advanced safety architectures
• 8x increase in I/O and PCIe ports expands the platform’s connectivity and scalability, adding acceleration extensions with ...

SHANGHAI and SANTA CLARA, Calif., Jan. 09, 2021 - NIO, a pioneer in China’s premium smart electric vehicle market, and NVIDIA announced today that the automaker has selected the NVIDIA DRIVE Orin™ system-on-a-chip (SoC) for its new generation of electric vehicles, which will offer advanced automated driving capabilities.

NIO is working ...

Broadband IoT Module for 5G NR FR1/FR2 in the Works

TOKYO & PARIS - January 7, 2021 - Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Sequans Communications (NYSE: SQNS), a leading provider of 5G/4G chips and modules for IoT, today announced an expansion of their collaboration ...

Low-Power Syntiant Core 2 Delivers 25x Tensor Throughput Without Extensive Post-training Compilation

IRVINE, Calif., Jan. 06, 2021 - Syntiant Corp., a deep learning chip technology company advancing AI pervasiveness in edge devices, today announced the availability of its Syntiant® NDP120™ Neural Decision Processor™ (NDP), the latest generation of special purpose chips ...

Advanced process to be developed with partial funding from the DARPA LUMOS program addressing high-speed communications

MIGDAL HAEMEK, Israel, January 05, 2021 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, today announced that it is participating in the LUMOS program, with partial support from DARPA, to ...