Semiconductor IP Industry News
February, 2019

February 27, 2019, San Jose, Calif. - eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will demonstrate two 7nm FinFET-class IP products at OFC 2019.

What:
SerDes Demonstrations: eSilicon Booth 5416
Tuesday-Thursday
March 5-7, 2019
Using Samtec ExaMAX Backplane Connector paddle cards and a five-meter ExaMAX Backplane ...

Deeper pipeline and significant instruction-set enhancements deliver higher performance with low energy

SAN JOSE, Calif., February 26, 2019 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Tensilica® ConnX B20 DSP IP, the highest-performing DSP in the popular ConnX family. Based on a deeper processor ...

New codec enables up to 1.6X performance improvement and better battery life for mobile communications applications

February 25, 2019 - SAN JOSE, Calif. - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it initiated and drove the standardization within 3GPP of an alternative fixed-point Enhanced Voice Services (EVS) codec reference ...

Synopsys' Portfolio of DesignWare Foundation, Analog, and Interface IP Accelerate ISO 26262 Qualification for ADAS, Powertrain, 5G, and Radar Automotive SoCs

MOUNTAIN VIEW, Calif., and SANTA CLARA, Calif., Feb. 21, 2019 -

Highlights:

• Synopsys DesignWare IP for automotive Grade 1 and Grade 2 temperature operation on GLOBALFOUNDRIES 22FDX® process includes Logic Libraries, Embedded ...

32G PHY will deliver power efficiency and performance for next-generation wireline and wireless infrastructure

SUNNYVALE, Calif. – February 20, 2019 – Rambus Inc. (NASDAQ: RMBS), a leading provider of semiconductor and IP products, today announced the availability of 32G Multi-protocol SerDes PHY on GLOBALFOUNDRIES 22nm FD-SOI (22FDX®) platform for high-volume, high-performance ...

Hsinchu, Taiwan - February 19, 2019 - eMemory's chip-embedded security IP received the Takuo Sugano Award for Outstanding Far-East Paper at the International Solid-State Circuits Conference (ISSCC).

The company received the honor at the flagship conference of the IEEE Solid-State Circuits Society February 18th in San Francisco for its paper ...

Freiburg, Germany - Grenoble, France - February 15, 2019 - TDK-Micronas, a TDK group company and the most preferred partner for sensing and control, has renewed its trust in Dolphin Integration’s low power and dense RAM and ROM for its 3D Hall magnetic sensor products.

TDK-Micronas is a renowned company on ...

Best-in-class IP and multiple FinFET/2.5D product bring-up programs set a rapid pace

SAN JOSE, Calif. - February 13, 2019 - eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the achievement of multiple milestones related to the company’s growth in the tier one ...

February 12, 2019 - LAWRENCEVILLE, Ga. - Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced that its phase-locked loop (PLL) technology has been deployed in Canaan Creative’s 7nm mining chip.

Canaan, the leader in offering blockchain hardware and software solutions and designing ASIC chips announced ...

Regulatory Certification Strengthens Inroads to Medical Simulation and Pre-surgical Planning Markets

MOUNTAIN VIEW, Calif., Feb. 11, 2019 -

Highlights:

• Simpleware ScanIP Medical obtains CE marking in EEA
• Simpleware ScanIP Medical is FDA 510(k) cleared in the United States, and is developed using an ISO 13485:2016 quality management system

Synopsys, Inc. (Nasdaq: SNPS) today announced the ...

Crestron DM NVX is the only network AV solution that delivers a flawless image every time

Amsterdam, ISE, February 6, 2019 – intoPIX, the leading provider of innovative image processing and video compression technologies developed a new codec called FlinQ in partnership with Crestron, the global leader of workplace and advanced ...

With more than 130 billion chips shipped to date Arm is everywhere compute happens. At MWC 2019, experts from across the business will lead industry conversations on what’s next as we enter the fifth wave of computing.

February 05, 2019 -- An MWC first: Insight and inspiration from tomorrow’s tech leaders

When: ...

Proven Open Standards-based Broadcast Technologies Applied for Pro AV Market

February 04, 2019 - MONT SAINT-GUIBERT, Belgium - intoPIX SA, a leading provider of innovative image processing technologies for professional media applications, announced today that it is demonstrating TICO-XS on Macnica’s 4K AV over 1GbE module at ISE 2019.

The demonstration will ...