Belgrade, Serbia - December 20th, 2016 - HDL Design House, a provider of high-performance digital and analog IP cores and system-on-chip (SoC) design and verification services, has joined the ARM® Approved Design Partner program, through which leading SoC design houses are recognized by ARM as accredited partners in specific technologies ...
New Ultrasound Technology Directly Embeds Arrays of Piezoelectric Transceivers to Create New Touch-Sensitive Panels and Metal Casings for Mobile Devices
SAN JOSE, Calif., Dec 15, 2016 - Cadence Design Systems, Inc. today announced that Sentons licensed the Cadence® Tensilica® ConnX BB32EP DSP for a new ultrasound technology that is dramatically ...
Texas-based organization has delivered over 16,000 scholarships to Vietnamese students
HO CHI MINH CITY, VIETNAM - December 13, 2016 - Sunflower Mission presented a total of 59 university scholarships to engineering and technology students in Ho Chi Minh City on November 29 and in Da Nang on December 1. Sunflower Mission, ...
Plymouth, UK, 12th December 2016 - Moortec Semiconductor, specialists in Process, Voltage and Temperature (PVT) sensors, announce the availability of their Embedded Voltage Monitor on TSMC’s 16nm FF+ and FFC processes.
The Voltage Monitor provides the means for advanced node Integrated Circuit (IC) developers to accurately measure core supply domain ...
Native SystemVerilog DisplayPort VIP Includes Built-In Coverage, Verification Planning and Protocol-Aware Debug
MOUNTAIN VIEW, Calif., Dec. 8, 2016 - Synopsys, Inc. today announced the availability of the industry's first Verification IP (VIP) and source code test suite for DisplayPort 1.4 with DSC 1.2 and for eDP 1.4a/b. With the increase in ...
Amazon EC2 F1 instances to include latest Xilinx 16nm UltraScale+ FPGAs
SAN JOSE, Calif., Dec. 7, 2016 - Xilinx, Inc. today announced that Amazon Web Services (AWS) is deploying Xilinx 16nm UltraScale+™ Field Programmable Gate Arrays (FPGAs) in the new Amazon Elastic Cloud Compute (Amazon EC2) F1 instance type, accelerating genomics, ...
How to navigate the complex HBM/2.5D ecosystem, plus what’s next for multi-chip integration
Dec 6, 2016, San Jose, Calif. - eSilicon, a leading semiconductor design and manufacturing solutions provider, will present at the 2016 3D Architectures for Semiconductor Integration and Packaging (ASIP) Conference held in San Francisco, California, December 13-15, 2016.
Session ...
SPICE Simulator Noted for Post-Layout Simulation Capabilities for Analog/Mixed-Signal Designs with Complex Interconnect Delays at 40nm and Below
SANTA CLARA, Calif. - December 2, 2016 - ICScape today announced its Parallel Simulation Program with Integrated Circuit Emphasis (SPICE) simulator was chosen by Kilopass Technology, Inc. to fully simulate its embedded non-volatile ...
Expanded Collaboration with NXP Semiconductors Delivers IP for Automotive and IoT
SANTA CLARA, Calif. - December 1, 2016 Silvaco, Inc. today announced an expanded collaboration with NXP® Semiconductors to bring MIPI I3C semiconductor intellectual property (IP) developed with NXP to market. As a result of this effort, a set ...