GUC
Semiconductor IP Industry News
GUC Announces Industry Highest Bandwidth and Power Efficient Die-to-Die (GLink 2.0) Total Solution
September 08, 2021
GUC and Omni Design Tape Out 16nm LiDAR SoC
July 15, 2021
GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric™ Advanced Packaging Technology
June 05, 2021
GUC and Ansys Expedite Advanced-IC Designs for Next-Generation Applications with State-of-the-Art Simulation Workflow
April 09, 2021
Global Unichip Corporation and Flex Logix Achieve First-Time Working Silicon on Joint ASIC Development Using EFLX Embedded FPGA (eFPGA) IP
February 11, 2021
GUC Die-to-Die (D2D) Total Solution Opening the New Era of Flagship SoC
November 21, 2020
GUC Announces ShenZhen Office Opening
December 04, 2018
GUC Announces 20th Anniversary
January 22, 2018
Global Unichip Achieves SGS-TUV ISO26262 Certification
August 02, 2017
GUC Opens New Korea Office
July 01, 2017
GUC Successfully Rolls out HBM2 Total Solution
June 19, 2017
GUC Unveils Solid State Drive ASIC Capabilities
February 06, 2017
GUC Opens New Netherlands Office
December 15, 2016
GUC Delivers 28G Multi-Standard SerDes IP
March 15, 2016
GUC/Partner Jointly Develop USB3.1 PHY/Controller IP
March 01, 2016
GUC Unveils Its First 16nm IP
May 22, 2014
Global Unichip Joins ChipEstimate.com
September 24, 2012
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Taiwan
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